Products

DESCRIPTION

Basic Info

Weight	500g/PC
Transport Package	Carton
Specification	3.15cm * 1.5cm * 1.0cm
Trademark	Xifeng, OEM
Origin	Shunde, Foshan, China
HS Code	831130000
Production Capacity	10800t/Year

Product Description

Tin Lead Free Solder Bar:

Our company provides Tin Lead Free Solder Bar with a variety of alloy composition , content and size of the diameter of pharmaceutical different specifications tin for customer choice. Introduction to Tin Solder Products
Tin solder is a widely used material in the electronics industry for joining electrical components. Our company offers a range of high-quality tin solder products, including solder wire, solder bar, and solder paste, to meet the diverse needs of our customers.

Solder Wire
Our solder wire is made from a high-purity tin and lead alloy, with a rosin flux core. The rosin flux is a natural, non-corrosive flux that cleans and prepares the surface to be soldered, ensuring a strong and reliable bond. Our solder wire comes in different diameters, from 0.5mm to 2.0mm, to suit various applications.

Solder Bar
Our solder bar is made from a high-purity tin and lead alloy, with a melting point of 183ºC. It is ideal for use in manual and automated soldering processes, and provides excellent wetting and flow properties. Our solder bar comes in different weights and sizes, from 100g to 1kg, to suit different soldering needs.

Solder Paste
Our solder paste is a mixture of finely powdered solder alloy and flux, which is used for surface mount technology (SMT) applications. It is ideal for soldering small and complex electronic components, such as integrated circuits, resistors, and capacitors. Our solder paste comes in different types, such as leaded and lead-free, to meet the environmental and regulatory requirements of different countries.